Labels Milestones
BackIrd*cos(lf2), ird*sin(lf2), h1], [ ord*cos(lf1), ord*sin(lf1), h1], [ ord*cos(lf1), ord*sin(lf1), h1], [ ird*cos(lf2), ird*sin(lf2), h1], [ 0,0,h2], [ ord*cos(lf0), ord*sin(lf0), h2], [ ird*cos(lf1), ird*sin(lf1), h0], [ ord*cos(lf2), ord*sin(lf2), h0], [ ird*cos(lf0), ird*sin(lf0), h1], [ 0,0,h2], [ ord*cos(lf0), ord*sin(lf0), h0], [ ord*cos(lf2), ord*sin(lf2), h0], [ ird*cos(lf0), ird*sin(lf0), h1], [ ird*cos(lf2), ird*sin(lf2), h1], [ ord*cos(lf1), ord*sin(lf1), h1], [ ird*cos(lf2), ird*sin(lf2), h1], [ 0,0,h2], Created on Tue Mar 5 20:19:51 2024 Copper Layer Stackup: ============================================================= L1 : F.Cu front L2 : B.Cu back Drill file 'precadsr-panel.drl' contains plated through holes: ============================================================= T1 3.200mm 0.1260" (4 holes) (with 4 slots T2 5.000mm 0.1969" (1 hole) Total plated holes Total unplated holes count 16 ============================================================= Total unplated holes count 16 Not plated through holes: merged pull request 'More schematics' (#3) from schematic by Eeschema 5.1.10-88a1d61d58~90~ubuntu20.04.1 Component Count: 77 Refs 3 pin Molex header 2.54 mm spacing