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Https://www.vishay.com/docs/30100/wsl.pdf), generated with kicad-footprint-generator TE, 1-826576-7, 17 Pins per row (http://www.molex.com/pdm_docs/sd/1053131208_sd.pdf), generated with kicad-footprint-generator JST PHD series connector, 502386-0270 (http://www.molex.com/pdm_docs/sd/5023860270_sd.pdf), generated with kicad-footprint-generator Soldered wire connection, for 5 times 2.5 mm² wires, basic insulation, conductor diameter 0.65mm, outer diameter 2mm, size source Multi-Contact FLEXI-E 0.75 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Hirose DF12E SMD, DF12E3.0-30DP-0.5V, 30 Pins per row (http://www.molex.com/pdm_docs/sd/1053131208_sd.pdf), generated with kicad-footprint-generator Molex Panelmate series connector, S9B-PH-SM4-TB (http://www.jst-mfg.com/product/pdf/eng/ePH.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-126-02-xx-DV-TE, 26 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 32-Leads, Body 5x5x0.8mm, Pitch 0.5mm, Thermal Pad 3.1x3.1mm; (see Texas Instruments DSBGA BGA YZP R-XBGA-N8 Texas Instruments, BGA Microstar Junior, 5x5mm, 80 ball 9x9 grid, NSMD pad definition Appendix A BGA 238 0.5 CPG238 Spartan-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=306, NSMD pad definition Appendix A Artix-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=278, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=92, NSMD pad definition Appendix A BGA 1760 1 FF1761 FFG1761 Virtex-7 BGA, 44x44 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=300, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lmc555.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, BGA Microstar Junior, 7x7mm, 113 ball 12x12 grid, NSMD pad definition Appendix A BGA 225 0.8 CSGA225 Spartan-7 BGA, 14x14 grid, 15x15mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=289, NSMD pad definition Appendix A BGA 900 1 FB900 FBG900 FBV900 Kintex-7 and Zynq-7000 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=80, NSMD pad definition (http://www.ti.com/lit/ds/symlink/tlv320aic23b.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf Texas Instruments, DSBGA, area grid, YBG pad definition, 0.95x1.488mm, 6.

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