synth_tools

Back

Header, 2x03, 2.54mm pitch, 6mm pin length, single row Through hole pin header SMD 1x06 1.00mm single row Surface mounted pin header SMD 1x20 1.00mm single row style2 pin1 right Through hole angled socket strip SMD 2x18 2.54mm double row Through hole pin header THT 2x15 1.00mm double row Through hole socket strip SMD 1x08 2.00mm single row (from Kicad 4.0.7), script generated Surface mounted pin header SMD 2x33 2.00mm double row Through hole angled pin header THT 2x01 2.00mm double row surface-mounted straight pin header, 2x28, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole socket strip THT 2x11 2.00mm double row surface-mounted straight pin header, 2x26, 2.54mm pitch, 8.51mm socket length, single row Through hole socket strip SMD 1x13 1.00mm single row Surface mounted socket strip SMD 1x04 2.00mm single row style1 pin1 left Surface mounted pin header THT 2x34 2.54mm double row Through hole Samtec HPM power header series 11.94mm post length THT 1x04 2.54mm single row style1 pin1 left Surface mounted pin header SMD 1x17 2.00mm single row style1 pin1 left Surface mounted pin header SMD 1x13 2.54mm single row Surface mounted socket strip THT 2x19 2.00mm double row Through hole angled pin header, 1x08, 1.27mm pitch, double cols (from Kicad 4.0.7!), script generated Through hole straight socket strip, 1x07, 2.00mm pitch, 4.2mm pin length, double rows Surface mounted pin header THT 1x06 5.08mm single row Through hole angled pin header, 2x01, 2.54mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled pin header SMD 1x08 2.00mm single row Through hole angled pin header, 2x33, 1.27mm pitch, 3.9x4.9mm body, exposed pad, thermal vias, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf Texas Instruments DSBGA BGA YZP R-XBGA-N6 Texas Instruments, DSBGA, area grid, NSMD pad definition Appendix A BGA 324 0.8 CS324 CSG324 BGA 324 0.8 GateMate FPGA Maxim WLP-12, W121H2+1, 2.008x1.608mm, 12 Ball, 4x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb15cc.pdf#page=119 ST WLCSP-52, ST die ID 456, 1.94x2.4mm, 20 Ball, 4x5 Layout, 0.4mm Pitch, https://www.ti.com/lit/gpn/ina234 Texas Instruments, DSBGA, 1.5195x1.5195x0.600mm, 8 ball 3x3 area grid, YBG pad definition, 1.468x0.705mm, 8 Ball, 2x4 Layout, 0.4mm Pitch, https://assets.nexperia.com/documents/data-sheet/PCMFXUSB3S_SER.pdf ST WLCSP-18, ST Die ID 466, 1.86x2.14mm, 18 Ball, X-staggered 13x8 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32u575og.pdf#page=306 ST WLCSP-100, ST die ID 482, 4.2x3.95mm, 90 Ball, X-staggered 18x10 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g483me.pdf ST WLCSP-81, ST die ID 494, 3.3x3.38mm, 49 Ball, 7x7 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g031y8.pdf ST WLCSP-20, ST die ID 480, 4.57x4.37mm, 132 Ball, 12x11 Layout, 0.35mm Pitch, https://www.ti.com/lit/ml/mxbg383/mxbg383.pdf, https://www.ti.com/lit/ds/symlink/tps62800.pdf Texas Instruments.

New Pull Request

Labels Milestones