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Bourns, 2100, http://www.bourns.com/docs/Product-Datasheets/2100_series.pdf?sfvrsn=3 L_Toroid Horizontal series Radial pin pitch 50.8mm 10W length 16.1mm width 9mm height 9mm Resistor, Axial_Power series, Box, pin pitch=40.64mm, 7W, length*width*height=38*6.4*6.4mm^3, http://cdn-reichelt.de/documents/datenblatt/B400/5WAXIAL_9WAXIAL_11WAXIAL_17WAXIAL%23YAG.pdf Resistor Axial_Power series Box pin pitch 7.50mm length 10mm diameter 4.5mm Tantal Electrolytic Capacitor, , http://www.vishay.com/docs/42037/53d.pdf CP Axial series Axial Horizontal pin pitch 25.4mm 5W length 25mm width 6.4mm height 6.4mm Resistor, Axial_Power series, Box, pin pitch=38.1mm, 7W, length*width*height=35.3*9.5*9.5mm^3, shunt pin pitch 75mm length 67mm diameter 29.0mm Electrolytic Capacitor CP Radial series Radial pin pitch 10.00mm length 11.0mm solder Pin_ with flat with hole, hole diameter 0.7mm THT pad as test Point, diameter 3.0mm z-position of LED center 2.0mm, 2 pins Rectangular size 5.0x2.0mm^2 z-position of LED center 2.0mm 2 pins LED, diameter 5.0mm z-position of LED center 1.6mm, 2 pins, pitch 5mm, size 60x9mm^2, drill diamater 1.1mm, pad diameter 2.6mm, see http://www.farnell.com/datasheets/100425.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_WAGO THT Terminal Block WAGO 236-105, 45Degree (cable under 45degree), 7 pins, single row style2 pin1 right Through hole socket strip THT 1x25 2.54mm single row Through hole angled socket strip, 1x22, 1.27mm pitch, 4.0mm pin length, double rows Surface mounted pin header SMD 1x24 1.00mm single row Surface mounted socket strip THT 1x01 2.54mm single row Through hole angled pin header SMD 2x24 1.27mm double row Through hole socket strip THT 2x06 2.54mm double row Through hole Samtec HPM power header series 11.94mm post length, 1x12, 5.08mm pitch, see http://www.vishay.com/docs/88656/kbu4.pdf Vishay KBU rectifier diode bridge Three phase, Bridge, Rectifier, https://www.comchiptech.com/admin/files/product/SC35VB80S-G%20Thru506369.%20SC35VB160S-G%20RevB.pdf 4-lead dip package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm² body, exposed pad, 4x4mm body, pitch 0.5mm UFBGA-64, 8x8 raster, 4.466x4.395mm package, pitch 0.6mm; http://ww1.microchip.com/downloads/en/DeviceDoc/39969b.pdf Zynq-7000 BGA, 15x15 grid, 13x13mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=279, NSMD pad definition Appendix A Virtex-7 BGA, 42x42 grid, 42.5x42.5mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=280, NSMD pad definition Appendix A BGA 484 0.8 CLG484 CL484 CLG485.

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