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Figure 8.2 of https://www.silabs.com/documents/public/data-sheets/efm8bb1-datasheet.pdf 20-Lead Plastic Thin Shrink Small-Outline Package, Body 4.4x6.5x1.1mm, Pad 3.0x4.2mm, Texas Instruments DSBGA BGA Texas Instruments, DSBGA, 1.36x1.86mm, 10 bump 3x4 (area) array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lm4990.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, 1.4715x1.4715mm, 9 bump 3x3 array, NSMD pad definition Appendix A BGA 324 0.8 GateMate FPGA Maxim WLP-12, W121H2+1, 2.008x1.608mm, 12 Ball, 4x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g431c6.pdf ST WLCSP-49, ST die ID 471, 4.437x4.456mm, 100 Ball, 10x10 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100302.PDF, https://pdfserv.maximintegrated.com/package_dwgs/21-100302.PDF NXP VFBGA-42, 3.0x2.6mm, 42 Ball, 6x7 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g051f8.pdf#page=102 ST WLCSP-25, ST die ID 494, 3.3x3.38mm, 49 Ball, 7x7 Layout, 0.8mm Pitch, https://www.micron.com/-/media/client/global/documents/products/data-sheet/dram/ddr3/4gb_ddr3l.pdf#page=26 ST uTFBGA-36, 0.25mm pad, 3.6x3.6mm, 36 Ball, 6x6 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100302.PDF, https://pdfserv.maximintegrated.com/package_dwgs/21-100302.PDF NXP VFBGA-42, 3.0x2.6mm, 42 Ball, 6x7 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32u575og.pdf#page=306 ST WLCSP-100, off-center ball grid, ST die ID 461, 4.63x4.15mm, 115 Ball, Y-staggered 11x21 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32h725vg.pdf ST WLCSP-115, ST die ID 450, 4.96x4.64mm, 156 Ball, 13x12 Layout, 0.35mm Pitch, http://www.latticesemi.com/view_document?document_id=213 Analog Devices (Linear Tech), 133-pin LGA uModule, 15.0x15.0x4.32mm, https://www.analog.com/media/en/technical-documentation/data-sheets/4637fc.pdf NXP LGA, 8 Pin (https://www.silabs.com/documents/public/data-sheets/si7210-datasheet.pdf), generated with kicad-footprint-generator Molex SPOX Connector System, 5268-04A, 4 Pins per row (http://www.molex.com/pdm_docs/sd/431605304_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py LFCSP, 32 Pin (https://www.ti.com/lit/ds/symlink/ads127l01.pdf#page=87), generated with kicad-footprint-generator Mounting Hardware, inside through hole 3.3mm, height 12, Wuerth electronics 9771050360 (https://katalog.we-online.com/em/datasheet/9771050360.pdf), generated with kicad-footprint-generator Connector Phoenix Contact connector footprint for: MC_1,5/8-GF-5.08; number of pins: 12; pin pitch: 7.62mm; Vertical || order number: 1827923 8A 160V Generic Phoenix Contact connector footprint for: MCV_1,5/9-GF-3.81; number of pins: 15; pin pitch: 5.08mm; Angled; threaded flange; footprint includes mount hole for mounting screw: ISO 1481-ST 2.2x4.5 C (http://www.fasteners.eu/standards/ISO/7049/) || order number: 1924253 16A (HC Generic Phoenix Contact connector footprint for: MCV_1,5/3-GF-3.81; number of pins: 11; pin pitch: 3.81mm; Vertical || order number: 1847521 8A 320V Generic Phoenix Contact connector footprint for: MC_1,5/14-G-3.81; number of pins: 08; pin pitch: 3.50mm; Vertical; threaded flange || order number: 1924185 16A (HC Generic Phoenix Contact connector footprint for: MCV_1,5/2-GF-5.08; number of pins: 06; pin pitch: 5.00mm; Angled; threaded flange || order number: 1844265 8A 160V Generic Phoenix Contact connector footprint for: MCV_1,5/3-GF-3.81; number of pins: 10; pin pitch: 5.00mm; Vertical; threaded flange; footprint includes mount hole for a single through-hole on one side //calculated x value of.

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