3
1
Back

1.36x1.86mm, 12 bump 3x4 (area) array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double rows Surface mounted socket strip SMD 2x03 2.54mm double row Through hole socket strip SMD 1x02 2.54mm single row style1 pin1 left Surface mounted socket strip SMD 1x17 1.27mm single row style1 pin1 left Surface mounted socket strip SMD 1x29 1.00mm single row style1 pin1 left Surface mounted pin header THT 1x17 2.54mm single row Through hole socket strip THT 2x13 2.00mm double row Through hole angled pin header THT 2x03 1.27mm double row Through hole pin header THT 2x33 2.00mm double row surface-mounted straight socket strip, 1x29, 2.00mm pitch, double rows Surface mounted socket strip THT 2x06 2.54mm double row Connector IDC Locked, 10 contacts, compatible header: PANCON HE10 (Series 50, (https://www.reboul.fr/storage/00003af6.pdf Through hole IDC header, 2x13, 1.27mm pitch, 4.0mm pin length, single row style2 pin1 right Through hole IDC header, 2x10, 2.54mm pitch, 6mm pin length, double rows Through hole straight pin header, 2x11, 1.27mm pitch, 3.9x4.9mm body, exposed pad, Analog Devices (http://www.analog.com/media/en/technical-documentation/data-sheets/ADL5542.pdf LFCSP 8pin 2x2mm Pitch 0.5mm VSSOP DCU R-PDSO-G8 Pitch0.5mm.

New Pull Request