3
1
Back

Socket, through-hole, row spacing 15.24 mm (600 mils 64-lead surface-mounted (SMD) DIP package, row spacing 11.48 mm (451 mils 16-lead surface-mounted (SMD) DIP package, row spacing 25.4 mm (1000 mils), LongPads 18-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads THT DIP DIL PDIP SMDIP 2.54mm 11.48mm 451mil 6-lead surface-mounted (SMD) DIP package, row spacing 25.4 mm (1000 mils), LongPads THT DIP DIL PDIP 2.54mm 7.62mm 300mil Socket LongPads 4-lead though-hole.

New Pull Request