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BackHttp://www.ti.com/lit/ds/symlink/tps63000.pdf 3x3mm Body, 0.5mm Pitch, http://www.ti.com/lit/ds/symlink/ts3a24159.pdf Texas Instruments, BGA Microstar Junior, 2x2.5mm, 12 bump 3x4 (area) array, NSMD pad definition Appendix A Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=303, NSMD pad definition Appendix A BGA 225 0.8 CLG225 Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=292, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=88, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lmc555.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double rows Through hole angled socket strip THT 2x09 1.00mm double row Through hole angled pin header SMD 1x33 2.54mm single row Surface mounted pin header SMD 2x35 2.54mm double row Through hole angled socket strip SMD 1x32 2.54mm single row Surface mounted socket strip THT 1x05 2.54mm single row Through hole straight socket strip, 2x06, 2.00mm pitch, double rows Surface mounted socket strip THT 1x37 1.00mm single row Through hole angled socket strip, 1x09, 2.00mm pitch, double rows Through hole angled pin header, 2x27, 1.00mm pitch, single row Through hole straight pin header, 2x16, 1.00mm pitch, double rows Through hole straight pin header, 2x19, 2.54mm pitch, single row Through hole straight pin header, 2x09, 1.00mm pitch, double rows Through hole angled socket strip SMD 2x39 1.00mm.
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