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09-65-2098, 9 Pins per row (http://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocNm=82181_SOFTSHELL_HIGH_DENSITY&DocType=CS&DocLang=EN), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55932-0330, 3 Pins (http://www.farnell.com/datasheets/2157639.pdf), generated with kicad-footprint-generator JST GH series connector, B2B-PH-K (http://www.jst-mfg.com/product/pdf/eng/ePH.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 6 times 0.127 mm² wires, basic insulation, conductor diameter 0.65mm, outer diameter.

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