Labels Milestones
BackCNY70 refective photo coupler/interrupter Vishay CNY70 refective photo coupler/interrupter Vishay CNY70 refective photo coupler/interrupter Vishay CNY70 refective photo coupler/interrupter Vishay CNY70 refective photo coupler/interrupter Vishay CNY70 refective photo coupler package for Kodenshi SG-105F, see http://www.kodenshi.co.jp/products/pdf/sensor/photointerrupter_ref/SG-105F.pdf package for Vishay CNY70 refective photo coupler package for Everlight ITR8307/F43, see https://everlighteurope.com/index.php?controller=attachment&id_attachment=5385 package for diode bridges, row spacing 7.62 mm (300 mils 18-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body size (see https://www.ctscorp.com/wp-content/uploads/194-195.pdf 5x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), SMDSocket, LongPads THT DIP DIL PDIP 2.54mm 22.86mm 900mil SMDSocket SmallPads 40-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, LongPads 48-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils 48-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils), LongPads 64-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/cvs.pdf SMD 8x-dip-switch SPST Omron_A6H-8101, Slide, row spacing 15.24 mm (600 mils), Socket 40-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), http://multimedia.3m.com/mws/media/494546O/3mtm-dip-sockets-100-2-54-mm-ts0365.pdf THT DIP DIL PDIP 2.54mm 22.86mm 900mil LongPads 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 6-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 22-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), Socket 16-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils), SMDSocket, LongPads 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin SMD 8x-dip-switch SPST Omron_A6S-810x, Slide, row spacing 8.9 mm (350 mils), SMDSocket, LongPads 8-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), SMDSocket, SmallPads 12-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see https://www.omron.com/ecb/products/pdf/en-a6h.pdf SMD DIP DIL PDIP 2.54mm 25.4mm 1000mil 40-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 4-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), Socket 10-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 22-lead though-hole mounted high-volatge DIP package (based on http://www.latticesemi.com/view_document?document_id=213 BGA 0.8mm 9mm 121 BGA-132 11x17 12x18mm 1.0pitch Altera BGA-144 M144 MBGA Altera UBGA U169 BGA-169 BGA-200, 14.5x10.0mm, 200 Ball, 12x22 Layout, 0.8x0.65mm Pitch, http://www.issi.com/WW/pdf/43-46LQ32256A-AL.pdf Altera BGA-256 M256 MBGA BGA-256, dimensions: https://www.xilinx.com/support/documentation/package_specs/ft256.pdf, design rules: https://www.xilinx.com/support/documentation/user_guides/ug1099-bga-device-design-rules.pdf Altera UBGA U324 BGA-324 BGA-624, 25x25 grid.
New Pull Request