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6.2 of http://www.st.com/resource/en/datasheet/stm32f746zg.pdf TFBGA-100, 10x10, 9x9mm package, pitch 0.5mm; see section 7.2 of http://www.st.com/resource/en/datasheet/stm32f378vc.pdf WLCSP-72, 9x9 raster, 3.639x3.971mm package, pitch 0.8mm TFBGA-121, 11x11 raster, 10x10mm package, pitch 0.4mm pad, 15x15mm, 289 Ball, 17x17 Layout, 0.8mm Pitch, https://www.micron.com/-/media/client/global/documents/products/data-sheet/dram/ddr3/4gb_ddr3l.pdf#page=25 FBGA-78, 10.5x9.0mm, 78 Ball, 9x13 Layout, 0.8mm Pitch, https://www.micron.com/-/media/client/global/documents/products/data-sheet/dram/ddr3/4gb_ddr3l.pdf#page=26 ST uTFBGA-36, 0.25mm pad, 3.6x3.6mm, 36 Ball, 6x6 Layout, 0.5mm Pitch, 0.3mm Ball, http://www.st.com/resource/en/datasheet/stm32l486qg.pdf UFBGA-144, 12x12 raster, 10x10mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=260, NSMD pad definition Appendix A BGA 900 1 FB900 FBG900 FBV900 Kintex-7 and Zynq-7000 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=276, NSMD pad definition (http://www.ti.com/lit/ds/symlink/bq51050b.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, BGA Microstar Junior, 7x7mm, 113 ball 12x12 grid, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, double cols (from Kicad 4.0.7), script generated Through hole angled pin header THT 2x24 2.00mm double row Through hole angled pin header THT 1x27 2.54mm single row Surface mounted socket strip SMD 1x39 1.27mm single row Through hole straight socket strip, 2x39, 2.00mm pitch, single row Through hole straight socket strip, 2x13, 2.54mm pitch, double cols (https://gct.co/files/drawings/bc085.pdf), script generated Through hole angled pin header, 2x36, 2.00mm pitch, 6.35mm socket length, single row (from Kicad 4.0.7), script generated Through hole angled pin header, 1x07, 1.27mm pitch, 4.0mm pin length, double rows Through hole angled socket strip, 1x04, 2.00mm pitch, 6.35mm socket length, single row Surface mounted socket strip THT 1x20 1.27mm single row Through hole angled socket strip, 1x06, 1.27mm pitch, double cols (https://gct.co/pdfjs/web/viewer.html?file=/Files/Drawings/BD091.pdf&t=1511594177220), script generated Surface mounted pin header THT 1x14 2.54mm single row Through hole angled pin header, 2x16, 2.54mm pitch, single row style2 pin1 right Through hole angled pin header, 2x11, 2.54mm pitch, 8.51mm socket length, double cols (from Kicad 4.0.7), script generated Through hole straight Samtec HPM power header series 11.94mm post length, 1x12, 5.08mm pitch, single row style1 pin1 left Surface mounted pin header THT 1x12 2.00mm single row Through hole socket strip THT 2x40 1.00mm double row surface-mounted straight socket strip, 1x16, 1.00mm pitch, double cols (from Kicad 4.0.7), script generated Surface mounted pin header SMD 1x16 2.54mm single row style2 pin1 right Through hole horizontal IDC box header THT 1x26 1.27mm single row Through hole angled pin header, 1x20, 2.54mm pitch, 6mm pin length, single row Through hole angled pin header THT 2x04 1.27mm double row Through hole angled socket.

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