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7x7x1.0 mm Body, 2.00 mm [TQFP] (see Microchip Packaging Specification 00000049BS.pdf 20-Lead Plastic Quad Flat, No Lead Package (MF) - 3x3x0.9 mm Body [LFCSP]; (see https://www.intersil.com/content/dam/Intersil/documents/l72_/l72.10x10c.pdf LFCSP VQ, 24 pin, exposed pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf 20-Pin Thermally Enhanced Thin Shrink Small Outline (SO), see https://docs.broadcom.com/cs/Satellite?blobcol=urldata&blobheader=application%2Fpdf&blobheadername1=Content-Disposition&blobheadername2=Content-Type&blobheadername3=MDT-Type&blobheadervalue1=attachment%3Bfilename%3DIPD-Selection-Guide_AV00-0254EN_030617.pdf&blobheadervalue2=application%2Fx-download&blobheadervalue3=abinary%253B%2Bcharset%253DUTF-8&blobkey=id&blobnocache=true&blobtable=MungoBlobs&blobwhere=1430884105675&ssbinary=true SSO Stretched SO SOIC Pitch 2.54 SSO Stretched SO SOIC Pitch 1.27 SSOP-8 2.9 x2.8mm Pitch 0.65mm Slug Down (PowerSO-36) [JEDEC MO-166] (http://www.st.com/resource/en/datasheet/vn808cm-32-e.pdf, http://www.st.com/resource/en/application_note/cd00003801.pdf HSOP 11.0x15.9mm Pitch 0.65mm Slug Down (PowerSO-36) [JEDEC MO-166] (http://www.st.com/resource/en/datasheet/tda7266d.pdf, www.st.com/resource/en/application_note/cd00003801.pdf HSOP, 32 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/8008S.pdf#page=20), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for a single 2.5 mm² wires, basic insulation, conductor diameter 0.9mm, outer diameter 1mm, size source Multi-Contact FLEXI-E 1.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times 0.1 mm² wires, reinforced insulation, conductor diameter 2.4mm, see http://www.4uconnector.com/online/object/4udrawing/20193.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_4Ucon THT Terminal Block 4Ucon ItemNo. 10696 vertical pitch 2.5mm size 8x5mm^2 drill 1.2mm pad 2.4mm Terminal Block Phoenix MKDS-3-5-5.08 pitch 5.08mm size 25.4x8.45mm^2 drill 1.1mm pad 2.1mm terminal block RND 205-00247 pitch 10.2mm size 25.4x8.3mm^2 drill 1.3mm pad 2.5mm terminal block RND 205-00300 pitch 10mm size 105x9mm^2 drill 1.3mm pad 2.5mm terminal block connector http://www.phoenixcontact.com/us/products/1814744/pdf PhoenixContact PTSM0.5 2 2.5mm vertical SMD spring clamp terminal block RND 205-00233 pitch 5.08mm size 20.3x11.2mm^2 drill 1.3mm pad 2.5mm terminal block RND 205-00003, 4 pins, pitch 5mm, size 51.5x15mm^2, drill diamater 1.3mm, pad diameter 1.4mm, length 8.5mm, width 2.8mm, e.g. Ettinger 13.13.890, https://katalog.ettinger.de/#p=434 Through hole angled socket strip, 2x47, 1.27mm pitch, double cols (https://gct.co/files/drawings/bc085.pdf), script generated Through hole IDC header, 2x17, 2.54mm pitch, single row Through hole straight pin header, 2x22, 1.00mm pitch, 2.0mm pin length, double cols (from Kicad 4.0.7), script generated Through hole angled pin header THT 2x37 2.54mm double row Through hole socket strip SMD Solder 3-pad Jumper, 1x1.5mm rounded Pads, 0.3mm gap, open SMD Solder Jumper, 1x1.5mm Pads, 0.3mm gap, open SMD Solder 3-pad Jumper, 1x1.5mm Triangular Pads, 0.3mm gap, pads 1-2 bridged with 1 copper strip SMD 1x12 1.27mm single row Surface mounted socket strip THT 2x30 2.54mm double row Through hole angled socket strip, 1x31, 2.00mm pitch, single row style1 pin1 left Surface mounted socket strip SMD.

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