X="5.1" y="5.0"/> <-- CV In main MK_VCO/Panels/fireball_vco_14hp_v1.scad 330 lines width = 36; // [1:1:84] // margins from edges h_margin = hole_dist_side + thickness; h_margin = hole_dist_side + thickness; col_left = thickness * 2; right_rib_x = width_mm - hole_dist_side - thickness; // column from edge plus hole radius // elevated sockets to fit in glide controls Final-ish tweaks More mounting hole 2.7mm no annular Mounting Hole 2.5mm, no annular m2 Mounting Hole 2.7mm, M2.5, ISO14580 mounting hole position tweaks More mounting hole 5.3mm m5 iso7380 Mounting Hole 6.4mm, M6 mounting hole 2.7mm m2.5 iso14580 Mounting Hole 5.3mm, M5, ISO14580 mounting hole 6.4mm no annular m5 iso14580 Mounting Hole 4.3mm, M4 mounting screws (https://www.vishay.com/docs/95423/sot227g2.pdf, https://www.vishay.com/docs/95793/vs-fc420sa10.pdf TR TO-3 TO3 TO-204 TO-3P-3, Horizontal, RM 2.286mm SIPAK Horizontal RM 1.27mm MultiwattF-15 staggered type-2 TO-220-11, Horizontal, RM 2.54mm, staggered type-1, see http://www.ti.com/lit/ds/symlink/lmd18200.pdf TO-220-15, Vertical, RM 2.54mm, see https://toshiba.semicon-storage.com/us/product/mosfet/to-247-4l.html TO-247-2 Horizontal RM 2.54mm TO-220F-3, Vertical, RM 2.54mm, see http://www.vishay.com/docs/88898/b2m.pdf DIL DIP PDIP 5.08mm 2.54 4-lead dip package for diode bridges, row spacing 15.24 mm (600 mils), Socket, LongPads 22-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin SMD 10x-dip-switch SPST CTS_Series194-10MSTN, Piano, row spacing 8.89 mm (350 mils), SMDSocket, SmallPads 24-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils 5-lead though-hole mounted DIP package, row spacing 8.9 mm (350 mils), SMDSocket, SmallPads 16-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 12-lead though-hole mounted DIP package, row spacing.
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