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CASE 506CN (see ON Semiconductor 506BU.PDF 8-Lead Plastic Small Outline Package (MS) [MSOP], variant of 8-lead though-hole mounted DIP package, row spacing 22.86 mm (900 mils), https://wiki.wemos.cc/products:d1:d1_mini, https://c1.staticflickr.com/1/734/31400410271_f278b087db_z.jpg DIN rail adapter universal three M3 clearance holes Mounting Hole 2.7mm, no annular, M3 mounting hole 2.7mm m2.5 Mounting Hole 4mm, no annular Mounting Hole 2.2mm, no annular, M3, ISO7380 mounting hole 6.4mm m6 din965 Mounting Hole 6.4mm, M6 mounting hole 3.7mm no annular Mounting Hole 4.3mm, M4, ISO14580 mounting hole 3.2mm m3 iso7380 Mounting Hole 5mm, no annular m6 din965 Mounting Hole 4.3mm, M4, ISO14580 mounting hole position tweaks More mounting hole 4.5mm no annular m5 iso7380 Mounting Hole 2.7mm, M2.5, ISO7380 mounting hole 6.4mm no annular Mounting Hole 4.3x6.2mm, M4 mounting hole 4.3x6.2mm m4 Mounting Hole 2.7mm, no annular, M4 mounting hole 4.3mm m4 Mounting Hole 8.4mm, M8 mounting hole 2.7mm no annular mounting hole 2.7mm m2.5 Mounting Hole 3.2mm, M3 mounting hole 2.2mm no annular m3 iso7380 Mounting Hole 2.7mm, M2.5 mounting hole.

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