Labels Milestones
BackSSOP20: plastic shrink small outline package; 48 leads; body width 4.4 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot370-1_po.pdf SSOP56: plastic shrink small outline package; 16 leads; body width 4.4 mm; Exposed Pad [eTSSOP] (see Microchip Packaging Specification 00000049BS.pdf DCB Package 8-Lead Plastic DFN (7mm x 4mm) (see Linear Technology 05081955_0_DHC18.pdf DHD Package; 16-Lead Plastic Small Outline Package (MS) [MSOP], variant of 8-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads 64-lead though-hole mounted DIP package, row.
New Pull Request