Labels Milestones
Back1.00 mm Pitch, Single Row, Vertical, Latch (source: https://suddendocs.samtec.com/prints/t1m-single-row-footprint.pdf conn samtec card-edge socket high-speed 0.8 mm BGA-64, 10x10 raster, 4.618x4.142mm package, pitch 0.35mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32l152zc.pdf UFBGA 132 Pins, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32mp151a.pdf ST TFBGA-225, 13.0x13.0mm, 225 Ball, 15x15 Layout, 0.8mm Pitch, https://www.ti.com/lit/ml/mpbg777/mpbg777.pdf BGA 289 0.8 ZAV S-PBGA-N289 Texas Instruments, DSBGA, 1.43x1.41mm, 8 bump 3x3 (perimeter) array, NSMD pad definition Appendix A BGA 676 1 FF676 FFG676 FFV676 Kintex-7 and Zynq-7000 BGA, 30x30 grid, 31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=305, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole straight pin header, 2x06, 2.54mm pitch, single row style2 pin1 right Through hole angled pin header SMD 1x21 1.00mm single row Surface mounted socket strip SMD 1x20 2.54mm single row style2 pin1 right Through hole.
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