3
1
Back

ID 479, 3.56x3.52mm, 64 Ball, 8x8 Layout, 0.4mm Pitch, YFF0006, NSMD pad definition Appendix A Kintex-7 and Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=304, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lmc555.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments EUW 7 Pin (https://b2b-api.panasonic.eu/file_stream/pids/fileversion/2787), generated with kicad-footprint-generator Capacitor SMD Kemet-E (7360-38 Metric), IPC_7351 nominal, (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py LFCSP, 32 Pin (https://www.ftdichip.com/Support/Documents/DataSheets/ICs/DS_FT4222H.pdf#page=40), generated with kicad-footprint-generator ipc_noLead_generator.py VQFN, 28 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0140.PDF (T2055-3)), generated.

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