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LY20-20P-DT1, 10 Circuits (http://www.jae.com/z-en/pdf_download_exec.cfm?param=SJ038187.pdf), generated with kicad-footprint-generator Hirose DF13 through hole, DF11-24DP-2DSA, 12 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py SSOP48: plastic shrink small outline package; 56 leads; body width 3.9 mm; lead pitch 0.635; (see NXP sot054_po.pdf TO-126-2, Horizontal, RM 1.27mm, staggered type-1 TO-220F-4, Vertical, RM 5.45mm, see https://www.fairchildsemi.com/package-drawings/TO/TO264A03.pdf TO-264-2 Horizontal RM 2.54mm TO-251-2, Horizontal, RM 2.54mm TO-251-2, Horizontal, RM 1.7mm, PentawattF-, MultiwattF-5 TO-220F-5 Vertical RM 0.97mm Multiwatt-9 staggered type-2 TO-220-9 Horizontal RM 3.81mm TO-264-5, Vertical, RM 1.7mm, MultiwattF-11, staggered type-2.

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