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9 bump 3x3 array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/tlv320aic23b.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf Texas Instruments, DSBGA, 1.36x1.86mm, 10 bump 3x4 (perimeter.

• [PATCH] Use THT electrolytics.
• 0.989339 0.0974854 0.108192 facet.
• -1.088952e+02 9.725134e+01 5.816697e+00 facet normal -0.286114.
• 0.237818 0.388083 0.890412 facet normal 0.063536 -0.807242.

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