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46007-1103, With thermal vias with large copper area, as proposed in http://www.ti.com/lit/ds/symlink/tps5430.pdf TSOP-I, 24 Pin (http://www.alfarzpp.lv/eng/sc/AS3330.pdf), generated with kicad-footprint-generator Soldered wire connection, for 4 times 0.15 mm².

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