Labels Milestones
BackTSSOP8: plastic thin shrink small outline package; 18 leads; body width 3.9 mm; lead pitch 0.65 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot369-1_po.pdf SSOP, 16 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-msop/05081667_F_MSE16.pdf), generated with kicad-footprint-generator.
- Size 29x15mm^2, drill diamater 1.2mm, pad diameter.
- 12 0.5 R-XBGA-N12 Texas Instruments, DSBGA, area.
- -0.268415 0.481075 facet normal.