Labels Milestones
BackRaster, 3.767x4.229mm package, pitch 0.5mm; see section 6.8 of http://www.st.com/resource/en/datasheet/stm32f746zg.pdf WLCSP-144, 12x12 raster, 7x7mm package, pitch 0.4mm; https://www.latticesemi.com/view_document?document_id=213 UCBGA-49, 7x7 raster, 3.89x3.74mm package, pitch 0.8mm; http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#p495 TFBGA-216, 15x15 raster, 13x13mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=78, NSMD pad definition Appendix A BGA 676 1.
- Normal 1.000000e+00 0.000000e+00 facet.
- Vertex 8.549 -4.11698 6.17306 vertex 9.05498.
- Normal -2.971779e-001 -5.209042e-001 8.002150e-001 facet normal 0.683048 -0.365098.
- Series, 4-way, 4.0mm pitch, AWG18-22 (0.3255-0.823mm2.