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105314-xx12, 6 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Hirose DF13 through hole, DF63R-4P-3.96DSA, 4 Pins per row (http://suddendocs.samtec.com/prints/lshm-1xx-xx.x-x-dv-a-x-x-tr-footprint.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole M3, height 5, Wuerth electronics 9776060960 (https://katalog.we-online.com/em/datasheet/9776060960.pdf), generated with kicad-footprint-generator Molex CLIK-Mate series connector, B22B-PHDSS (http://www.jst-mfg.com/product/pdf/eng/ePHD.pdf), generated with kicad-footprint-generator Hirose DF13 through hole, DF63-5P-3.96DSA, 5 Pins per row (https://cdn.harwin.com/pdfs/M20-890.pdf), generated with kicad-footprint-generator connector JST J2100 series connector, B13B-XH-A (http://www.jst-mfg.com/product/pdf/eng/eXH.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for a single 0.75 mm² wires, reinforced insulation, conductor diameter 1.25mm, outer diameter 2.3mm, size source Multi-Contact FLEXI-E 1.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_noLead_generator.py Texas VSON-HR, 8 Pin (http://www.ti.com/lit/ml/mpds382b/mpds382b.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 24 Pin (http://www.ti.com/lit/ds/symlink/bq24133.pdf#page=40 Texas Instruments, DSBGA-6, 0.704x1.054mm, NSMD, YKA pad definition, 1.468x0.705mm, 8 Ball, 2x4 Layout, 0.5mm Pitch, http://www.ti.com/lit/ds/symlink/ts3a24159.pdf Texas Instruments, DSBGA, 3.33x3.488x0.625mm, 49 ball 7x7 area grid, NSMD pad definition Appendix A BGA 238 0.5 CPG238 Spartan-7 BGA, 18x18 grid, 15x15mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=79, NSMD pad definition (http://www.ti.com/lit/ds/symlink/bq51050b.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments EUW 7 Pin Double Sided Module Texas Instruments DSBGA BGA YZP R-XBGA-N8 Texas Instruments, DSBGA, area grid, NSMD pad definition Appendix A BGA 225 0.8 CSGA225 Spartan-7 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=263, NSMD pad definition Appendix A Spartan-7 BGA, 18x18 grid, 15x15mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=80, NSMD pad definition Appendix A Virtex-7 BGA, 44x44 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=304, NSMD pad definition Appendix A BGA 400 0.8 CLG400 CL400 Zynq-7000 BGA, 20x20 grid, 17x17mm package, 0.8mm.

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