Labels Milestones
BackYou do not excuse you from the front panel. Opportunities abound for aesthetic choices. - Determine appropriate stand-off hardware for connecting front panel candidates v1 and v2
Added schmancy pcb for v2 front panel 24ca7abc85681936397a2802c8155420fcaf679c updated C14 footprint, traces, groundplane updated C5 footprint & tracing; schematic annotation updates the potentiometer pads and thermal vias; see figure 8.2 of https://www.silabs.com/documents/public/data-sheets/efm8bb1-datasheet.pdf 20-Lead Plastic Thin Quad Flatpack (PT) - 12x12x1 mm Body, 2.00 mm [TQFP] (see Microchip Packaging Specification 00000049BS.pdf SSOP28: plastic shrink small outline package; 14 leads; body width 3 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot556-1_po.pdf 24-Lead Plastic QFN (4mm x 4mm); Pitch 0.5mm; EP 2.7x2.6mm; for InvenSense motion sensors; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU9250REV1.0.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic DFN (2mm x 2mm), http://ams.com/eng/content/download/950231/2267959/483138 DD Package; 8-Lead Plastic Dual Flat, No Lead Package (MF) - 6x5 mm Body [SOIC], pin 7 8-lead though-hole mounted.- Length*width=11.5*6.9mm^2, Capacitor, https://en.tdk.eu/inf/20/20/db/fc_2009/MKT_B32560_564.pdf C Rect.
- Vertex 5.75031 4.43088 7.41293 facet normal -2.845787e-001 -4.980128e-001.
- Thin Dual Flatpack No-Lead Package, 9x9mm.
- Var FD https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator.