3
1
Back

9 bump 3x3 (perimeter) array, NSMD pad definition Appendix A BGA 676 1 FG676 FGG676 Spartan-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=297, NSMD pad definition Appendix A BGA 1760 1 FH1761 FHG1761 Virtex-7 BGA, 42x42 grid, 42.5x42.5mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=289, NSMD pad definition Appendix A BGA 484 1 FB484 FBG484 FBV484 Artix-7, Kintex-7 and Zynq-7000 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=301, NSMD pad definition Appendix A Virtex-7 BGA, 42x42 grid, 42.5x42.5mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=306, NSMD pad definition Appendix A Artix-7 and Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=276, NSMD pad definition (http://www.ti.com/lit/ds/symlink/ts5a3159a.pdf Texas Instruments (http://www.ti.com/lit/ds/symlink/tps22993.pdf QFN, 24 Pin (http://www.ti.com/lit/ds/symlink/msp430f1101a.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py LQFP, 64 Pin (http://www.ti.com/lit/ds/symlink/tusb8041.pdf#page=42), generated with kicad-footprint-generator Molex PicoBlade series connector, SM20B-SRSS-TB (http://www.jst-mfg.com/product/pdf/eng/eSH.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 6 times 1 mm² wires, basic insulation, conductor diameter 2mm, outer diameter.

New Pull Request