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BGA 5 0.5 YZP Texas Instruments, DSBGA, area grid, YZT, 1.86x1.36mm, 12 Ball, 4x3 Layout, 0.4mm Pitch, https://www.ti.com/lit/gpn/ina234 Texas Instruments, DSBGA, 0.822x1.116mm, 5 bump 2x1x2 array, NSMD pad definition Appendix A BGA 1156 1 FF1157 FFG1157 FFV1157 FF1158 FFG1158 FFV1158.

• Wire 2.5sqmm double-strain-relief Soldered wire connection.
• Normal 0.40362 -0.491814 0.771499.
• WAGO 804-114, 45Degree (cable under.
• 23 Pins per row.

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