synth_tools

Back

20mm Electrolytic Capacitor C, Rect series, Radial, pin pitch=15.00mm, , length*width=16.5*8.9mm^2, Capacitor, https://en.tdk.eu/inf/20/20/db/fc_2009/MKT_B32560_564.pdf C Rect series Radial pin pitch 5.00mm length 8mm width 2.5mm Capacitor C, Rect series, Radial, pin pitch=23.70mm, , diameter=24.4mm, muRATA, 1400series, http://www.murata-ps.com/data/magnetics/kmp_1400.pdf Inductor Radial series Radial pin pitch 29.30mm diameter 29.8mm muRATA 1400series Inductor, Radial series, Radial, pin pitch=5.00mm, , length*width=7*3.5mm^2, Capacitor C Rect series Radial pin pitch 5.08mm size 35.6x10.6mm^2 drill 1.3mm pad 2.5mm terminal block RND 205-00307 pitch 10mm size 35x9mm^2 drill 1.3mm pad 2.5mm terminal block RND 205-00294 pitch 5.08mm size 10.2x8.45mm^2 drill 1.1mm pad 2.1mm terminal block Metz Connect Type171_RT13705HBWC, 5 pins, pitch 5.08mm, size 15.2x11.2mm^2, drill diamater 1.3mm, pad diameter 2.4mm, outer diameter 1.7mm, size source Multi-Contact FLEXI-xV 1.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55932-1510, with PCB locator, 11 Pins (http://www.molex.com/pdm_docs/sd/559350530_sd.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-129-02-xxx-DV-BE-LC, 29 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Harwin Female Vertical Surface Mount Package (https://www.fairchildsemi.com/package-drawings/ML/MLSOP08A.pdf Power Integrations eDIP-12B, see https://www.power.com/sites/default/files/product-docs/linkswitch-pl_family_datasheet.pdf 4-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm (400 mils), LongPads 42-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 18-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads 28-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://omronfs.omron.com/en_US/ecb/products/pdf/en-a6s.pdf SMD 5x-dip-switch SPST , Slide, row spacing 11.48 mm (451 mils 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), see https://ac-dc.power.com/sites/default/files/product-docs/tinyswitch-iii_family_datasheet.pdf Power Integrations eDIP-12B, see https://www.power.com/sites/default/files/product-docs/linkswitch-pl_family_datasheet.pdf 4-lead surface-mounted (SMD) DIP package, row spacing 11.48 mm (451 mils 22-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils.

New Pull Request

Labels Milestones