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Shenzhen Jing Tuo Jin Electronics Co 918-118A2021Y40002 ( https://datasheet.lcsc.com/lcsc/1912111437_Jing-Extension-of-the-Electronic-Co--918-118A2021Y40002_C399939.pdf ) also compatible with SOIC-8, 3.9x4.9mm² body, exposed pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf 20-Pin Thermally Enhanced Thin Shrink Small Outline Narrow Body Body [QSOP] (http://www.allegromicro.com/~/media/Files/Datasheets/ACS726-Datasheet.ashx?la=en Allegro Microsystems 12-Lead (10-Lead Populated) Quad Flat No-Lead Package, 3x3mm Body (see Atmel Appnote 8826 10-Lead Plastic XDFN (1.35mm x 2.2mm) (see https://www.onsemi.com/pdf/datasheet/emi8132-d.pdf Thermally-enhanced SO-8 PowerPAK.

CA6-H2,5, http://www.acptechnologies.com/wp-content/uploads/2017/06/01-ACP-CA6.pdf Potentiometer vertical Alps RK09L Single, https://tech.alpsalpine.com/prod/e/pdf/potentiometer/rotarypotentiometers/rk09l/rk09l.pdf.
Inductors Bourns SMD SRP7028A Bourns SRP1208.
2.299961e-03 7.659837e-01 vertex -1.088952e+02 9.725134e+01 5.816697e+00 facet normal.
-0.288937 0.749604 0.59549 vertex 5.40021 -4.41978.

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