Labels Milestones
BackFFC/FPC, 502250-3991, 39 Circuits (http://www.molex.com/pdm_docs/sd/5022503991_sd.pdf), generated with kicad-footprint-generator Molex Pico-Clasp series connector, B24B-PUDSS (http://www.jst-mfg.com/product/pdf/eng/ePUD.pdf), generated with kicad-footprint-generator Molex Picoflex Ribbon-Cable Connectors, 90325-0018, 18 Pins (https://www.molex.com/pdm_docs/sd/026604020_sd.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py PowerPAK 1212-8 Single Zetex, SMD, 8 pin SIM connector for 1.6mm PCB's with 40 contacts (not polarized Highspeed card edge connector for PCB's with 20 contacts (not polarized Highspeed card edge connector for IQRF TR-x2D(C)(T) modules, http://iqrf.org/weben/downloads.php?id=104 Bluetooth v4.2 + NFC module Modtronix Wireless SX1276 LoRa Module (http://modtronix.com/img/prod/imod/inair9/inair_dimensions.gif Modtronix LoRa inAir inAir9 SX1276 RF 915MHz 868MHz Wireless RAK811 LPWAN Module https://downloads.rakwireless.com/LoRa/RAK811/Hardware_Specification/RAK811_LoRa_Module_Datasheet_V1.4.pdf RAK4200 LPWAN Module https://downloads.rakwireless.com/LoRa/RAK4200/Hardware-Specification/RAK4200_Module_Specifications_V1.4.pdf Class 2 Bluetooth Module with on-board Fireball/Fireball.kicad_pcb | 2 Fireball/Fireball.kicad_prl | 8 "active_layer_preset": "All Layers", "active_layer_preset": "All Copper Layers", re-re-remove the mysterious extra trace Add notes about UX component wiring Add notes about UX component wiring initial notes for v1 build - C1 is too small for film; is film needed? - Smaller cap (476nF?) for C1 Ceramic 104s for C10, C14.
- 28 .../ao_tht.pretty/analogoutput.kicad_mod | 213 .../ao_tht.pretty/analogoutput_12mm.kicad_mod .
- 4.24331 -2.97557 21.7998 vertex 4.03376 2.95564.
- 6-10turn HAM0631A-HAM1031A Neosid, Air-Coil, SML.