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Copal_CHS-10B, Slide, row spacing 6.73 mm (264 mils), body size 10.8x14.26mm 5x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), Socket 8-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), LongPads 48-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils DIL DIP PDIP 5.08mm 2.54 4-lead dip package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm body, exposed pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf 20-Pin Thermally Enhanced Thin.

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