Labels Milestones
BackJunior, 5x5mm, 80 ball 9x9 grid, NSMD pad definition (http://www.ti.com/lit/ds/symlink/opa330.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, area grid, NSMD pad definition Appendix A BGA 238 0.5 CP236 CPG236 Artix-7 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=262, NSMD pad definition Appendix A BGA 256 1 FT256 FTG256 Spartan-7 BGA, 14x14 grid, 15x15mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=279, NSMD pad definition (http://www.ti.com/lit/ds/symlink/bq51050b.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole pin header THT 1x35 2.54mm single row (from Kicad 4.0.7), script generated Through hole IDC header, 2x08, 2.54mm pitch, double rows Surface mounted socket strip SMD 1x06 1.00mm single row Through hole IDC header, 2x20, 1.00mm pitch, single row Through hole straight pin header, 1x18, 2.54mm pitch, double cols (from Kicad 4.0.7), script generated Surface mounted pin header THT 2x06 2.54mm double row surface-mounted straight socket strip, 2x20, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows Through hole angled pin.
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