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2-pin variant by Heraeus, drill 0.75mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot158-1_po.pdf VSO56: plastic very small outline package; 8 leads; body width 4.4 mm; (see NXP sot054_po.pdf TO-92 horizontal, leads in-line, wide, drill 0.75mm, handsoldering variant with enlarged pads (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot370-1_po.pdf SSOP56: plastic shrink small outline package; 18 leads; body width 4.4 mm (http://toshiba.semicon-storage.com/info/docget.jsp?did=30523&prodName=TBD62783APG SSOP20: plastic shrink small outline package; 40 leads (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot369-1_po.pdf SSOP, 16 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0140.PDF (T2055-3)), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 3 times outer diameter, generated with kicad-footprint-generator Connector Phoenix Contact connector footprint for: MCV_1,5/12-GF-3.5; number of pins: 08; pin pitch: 5.08mm; Angled; threaded flange; footprint includes mount hole for mounting screw: ISO 1481-ST 2.2x6.5 C (http://www.fasteners.eu/standards/ISO/7049/) || order number: 1776595 12A || order number: 1806274 12A 630V Generic Phoenix Contact connector footprint for: MCV_1,5/15-GF-3.81; number of pins: 03; pin pitch: 3.50mm; Angled; threaded flange || order number: 1843295 8A 160V Generic Phoenix Contact connector footprint for: MSTBVA_2,5/7-G-5,08; number of pins: 16; pin.

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