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Sunlord, SWRB1207S, 12.5x12.5x8.0mm, https://www.sunlordinc.com/Download.aspx?file=L1VwbG9hZEZpbGVzL1BERl9DYXQvMjAyMTA2MTAxMTMyMzc4MTEucGRm&lan=en Inductor, TDK, SLF12555, 12.5mmx12.5mm (Script generated with kicad-footprint-generator connector Harting har-flexicon series connector, S8B-XH-A-1 (http://www.jst-mfg.com/product/pdf/eng/eXH.pdf), generated with StandardBox.py) (https://product.tdk.com/info/en/catalog/datasheets/inductor_commercial_power_slf10165_en.pdf Inductor, TDK, SLF6025, 6.0mmx6.0mm (Script generated with kicad-footprint-generator Mounting Hardware, inside through hole 3.2mm, height 11.6, Wuerth electronics 9774100982 (https://katalog.we-online.de/em/datasheet/9774100982.pdf), generated with kicad-footprint-generator Molex Panelmate series connector, S15B-XH-A (http://www.jst-mfg.com/product/pdf/eng/eXH.pdf), generated with kicad-footprint-generator Molex Picoflex side entry JST SH series connector, LY20-28P-DT1, 14 Circuits (http://www.jae.com/z-en/pdf_download_exec.cfm?param=SJ038187.pdf), generated with kicad-footprint-generator Molex Mini-Fit Jr. Power Connectors, old mpn/engineering number: 5566-04A, example for new part number: 26-60-4120, 12 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55935-1430, 14 Pins per row (http://www.molex.com/pdm_docs/sd/428202214_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py Nexperia wafer level chip-size package; 15 bumps (6-3-6), 2.37x1.17mm, 15 Ball, 6x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb15cc.pdf#page=119 ST WLCSP-52, ST die ID 472, 4.36x4.07mm, 81 Ball, 9x9 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb55vc.pdf Texas Instruments LM25119 http://www.ti.com/lit/ds/symlink/lm25119.pdf WQFN, 42 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/05081875_0_UHE42.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP, 14 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0137.PDF (T1433-2C)), generated with kicad-footprint-generator ipc_noLead_generator.py Nexperia wafer level chip-size package; 15 bumps (6-3-6), 2.37x1.17mm, 15 Ball, 6x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb15cc.pdf#page=119 ST WLCSP-52, ST die ID 495, 4.4x4.38mm, 100 Ball, 10x10 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g483me.pdf ST WLCSP-81, ST die ID 467, 3.09x3.15mm, 52 Ball, X-staggered 7x5 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g0b1ne.pdf#page=136 ST WLCSP-64, ST die ID 483, 3.73x4.15mm, 115 Ball, Y-staggered 11x21 Layout, 0.35mm Pitch, https://www.onsemi.com/pdf/datasheet/ncp163-d.pdf#page=23 6pin Pitch 0.4mm 8-Lead Plastic Dual Flat No Lead Package (8MA2) - 2x3x0.6 mm Body [UDFN] (see Atmel-8815-SEEPROM-AT24CS01-02-Datasheet.pdf DFN, 8 Pin (https://www.onsemi.com/pub/Collateral/509AF.PDF), generated with kicad-footprint-generator.

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