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Nexperia wafer level chip-size package; 15 bumps (6-3-6), 2.37x1.17mm, 15 Ball, 6x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g491re.pdf ST WLCSP-81, ST die ID 450, 4.96x4.64mm, 156 Ball, 13x12.

• (https://www.hirose.com/product/en/products/DF52/DF52-3S-0.8H%2821%29/), generated with kicad-footprint-generator JST XA.
• 0.577975 vertex 4.46654 5.55594 7.22283 vertex -4.54285.
• -0.840148 -0.533173 0.0993848 facet normal.
• 24 leads; body width 3.9 mm.

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