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24-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), LongPads 14-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads 12-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils), Clearance8mm 18-lead surface-mounted (SMD) DIP package, row spacing 6.73 mm (264 mils), body size 9.78x25.04mm.

• Angle USB TYPE C, RA RCPT PCB, SMT.
• -1.058603e+02 9.665134e+01 1.028697e+01 vertex -1.052509e+02.
• 3.53708 facet normal -0.237813 -0.388084.

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