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Back40; // widest element is rotary, at 30mm right_panel_width = width_mm - hole_dist_side - thickness; // column from edge plus hole radius // mounting holes to PCB edge 10.889999999999999mm, see https://disti-assets.s3.amazonaws.com/tonar/files/datasheets/16730.pdf 15-pin D-Sub connector horizontal angled 90deg THT female pitch 2.29x1.98mm pin-PCB-offset 8.35mm mounting-holes-distance 25mm mounting-hole-offset 25mm 9-pin D-Sub connector, horizontal/angled (90 deg), THT-mount, male, pitch 2.29x1.98mm, distance of mounting holes to PCB edge 7.4799999999999995mm, see https://disti-assets.s3.amazonaws.com/tonar/files/datasheets/16730.pdf 15-pin D-Sub connector, horizontal/angled (90 deg), THT-mount, female, pitch 2.29x2.54mm, pin-PCB-offset 9.4mm, see http://docs-europe.electrocomponents.com/webdocs/1585/0900766b81585df2.pdf 62-pin D-Sub connector straight rugged MUSB D511 USB 2.0 and PD, http://www.krhro.com/uploads/soft/180320/1-1P320120243.pdf usb usb-c 2.0 pd USB TYPE C, RA RCPT PCB, SMT, http://www.jae.com/z-en/pdf_download_exec.cfm?param=SJ117928.pdf USB C Type-C Receptacle SMD USB 2.0 Type B SMT Horizontal 5 Contacts (https://katalog.we-online.de/em/datasheet/65100516121.pdf Mini USB 2.0 Type C Plug Shenzhen Jing Tuo Jin Electronics Co 918-118A2021Y40002 ( https://datasheet.lcsc.com/lcsc/1912111437_Jing-Extension-of-the-Electronic-Co--918-118A2021Y40002_C399939.pdf ) also compatible with SOIC-8, 3.9x4.9mm body, exposed pad, thermal vias and counter-pad, see http://www.ti.com/lit/ds/symlink/tps62177.pdf WSON-10 package 2x3mm body, pitch 0.5mm, see http://www.ti.com/lit/ds/symlink/tps62177.pdf WSON-10 package 2x3mm body, pitch 0.5mm UFBGA-64, 8x8 raster, 4.539x4.911mm package, pitch 0.8mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32f051t8.pdf WLCSP-36, 6x6 raster, 2.553x2.579mm package, pitch 0.35mm; see section 7.6 of http://www.st.com/resource/en/datasheet/stm32f207vg.pdf WLCSP-66, 8x9 raster, 3.767x4.229mm package, pitch 0.4mm; see section 6.8 of http://www.st.com/resource/en/datasheet/stm32f746zg.pdf WLCSP-144, 12x12 raster, 10x10mm package, pitch 0.8mm; http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#p495 TFBGA-216, 15x15 raster, 10x10mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=260, NSMD pad definition Appendix A BGA 484 0.8 SBG485 SBV485 LFCSP, exposed pad, thermal vias, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf Texas Instruments EUK 7 Pin Double Sided Module Texas Instruments EUS 5 Pin (https://www.jedec.org/sites/default/files/docs/MO-193D.pdf variant BA), generated with kicad-footprint-generator JST SUR series connector, BM01B-ACHSS-A-GAN-ETF (http://www.jst-mfg.com/product/pdf/eng/eACH.pdf), generated with kicad-footprint-generator Molex PicoBlade series connector, DF3EA-02P-2H (https://www.hirose.com/product/document?clcode=CL0543-0332-0-51&productname=DF3EA-5P-2H(51)&series=DF3&documenttype=2DDrawing&lang=en&documentid=0001163317), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: 22-27-2111, 11 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: A-41791-0005 example for new part number: A-41792-0002 example for new part number: A-41791-0012 example for new mpn: 39-30-0060, 3 Pins per row (http://www.molex.com/pdm_docs/sd/530480210_sd.pdf), generated with kicad-footprint-generator Molex Pico-SPOX Connector System, 43045-1200 (alternative finishes: 43045-160x), 8 Pins per row (http://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocNm=82181_SOFTSHELL_HIGH_DENSITY&DocType=CS&DocLang=EN.
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