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BackHttps://www.st.com/resource/en/datasheet/stm32l496wg.pdf ST WLCSP-132, ST die ID 461, 4.63x4.15mm, 115 Ball, Y-staggered 11x21 Layout, 0.35mm Pitch, https://www.ti.com/lit/ml/mxbg383/mxbg383.pdf, https://www.ti.com/lit/ds/symlink/tps62800.pdf Texas Instruments, DSBGA, area grid, YBG pad.
- Security, Inc. All rights reserved.
- And Zynq-7000 BGA, 22x22 grid, 23x23mm.
- 1x03, 5.08mm pitch, single row.
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