Labels Milestones
BackBump 2x3 (perimeter) array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0104.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf Texas Instruments, DSBGA, area grid, NSMD pad definition Appendix A BGA 484 0.8 SB484 SBG484 SBV484 Zynq-7000 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=80, NSMD pad definition (http://www.ti.com/lit/ds/slas718g/slas718g.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.4mm socket length, double rows Surface mounted socket strip THT 1x25 2.54mm single row style2 pin1 right Through hole IDC header, 2x08, 1.27mm pitch, double rows Through hole straight pin header, 2x19, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 9.5mm latches, mounting holes, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole pin header THT 2x06 1.27mm double row Through hole angled pin header, 2x03, 2.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole Samtec HPM power header series 11.94mm post length THT 1x19 1.00mm single row style2 pin1 right Through hole angled socket strip SMD 2x05 2.00mm double row Through hole straight pin header.
- Angle (https://www.we-online.com/katalog/datasheet/692122030100.pdf USB 3.0.
- Connector, S07B-ZESK-2D (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator Harwin Male.