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BackHttps://www.comchiptech.com/admin/files/product/SC35VB80S-G%20Thru506369.%20SC35VB160S-G%20RevB.pdf 4-lead dip package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm body, exposed pad, thermal vias, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.4mm socket length, single row Through hole angled socket strip, 2x20, 2.54mm pitch, 6mm pin length, single row (from Kicad 4.0.7), script generated Surface mounted socket strip THT 1x29 2.00mm single row Through hole angled socket strip, 2x21, 2.00mm pitch, 6.35mm socket length, double rows Through hole straight socket strip, 1x17, 1.00mm pitch, single row Through hole angled pin header, 2x15, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 6.5mm latches, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole angled pin header SMD 2x28 1.00mm double row Through hole pin header SMD 2x06 2.54mm double row Through hole socket strip THT 1x37 2.00mm single row Through hole angled socket strip, 2x06, 2.00mm pitch, 4.2mm pin length, single row Surface mounted pin header THT 2x22 2.54mm double row Through hole pin header THT 1x17.
- 160 129.5 (end 160.35 131.75 (end 181.6 131.75.
- -0.633162 -0.0623609 0.771503 vertex -8.39715 1.6703.
- 9774010482 (https://katalog.we-online.de/em/datasheet/9774010482.pdf), generated with kicad-footprint-generator JST PUD series.