Labels Milestones
BackF.Mask" "Notes": "Layer B.Mask" "Notes": "Layer B.Mask" "Notes": "Layer B.Cu" "Notes": "Layer F.SilkS" "Notes": "Layer B.Paste" "Notes": "Layer F.SilkS" "Notes": "Layer F.Paste" "Notes": "Layer B.Cu" "Notes": "Layer B.Paste" "Notes": "Layer B.Cu" "Notes": "Layer F.Paste" "Notes": "Layer F.Cu" "Notes": "Layers L1/L2" "Notes": "Layer F.Mask" "Notes": "Layer F.SilkS" "Notes": "Layer F.Mask" "Notes": "Layer F.Cu" "Notes": "Layers L1/L2" "Notes": "Layer F.SilkS" "Notes": "Layer B.Paste" "Notes": "Layer B.Mask" "Notes": "Layer B.Cu" "Notes": "Layer B.SilkS" ; DRILL file {KiCad 7.0.11-7.0.11~ubuntu22.04.1} date Tue Mar 5 20:19:51 2024 Copper Layer Stackup: T5 15.200mm 0.5984" (1 hole) T3 7.000mm 0.2756" (6 holes) T4 10.000mm 0.3937" (4 holes) T5 15.200mm 0.5984" (1 hole) T3 7.000mm 0.2756" (6 holes) T4 10.000mm 0.3937" (4 holes) (with 4 slots T2 5.000mm 0.1969" (1 hole) T3 7.000mm 0.2756" (6 holes T4 10.000mm 0.3937" (4 holes) (with 4 slots T2 5.000mm 0.1969" (1 hole) T3 7.000mm 0.2756" (6 holes) T4 10.000mm 0.3937" (4 holes T5 15.200mm 0.5984" (1 hole) T3 7.000mm 0.2756" (6 holes) T4 10.000mm 0.3937" (4 holes) T5 15.200mm 0.5984" (1 hole) Total plated holes unplated through holes: ============================================================= T1 3.200mm 0.1260" (4 holes) (with 4 slots T2 5.000mm 0.1969" (1 hole Total plated holes count 16 Not plated through holes: ============================================================= T1 3.200mm.
- 505405-0670 (http://www.molex.com/pdm_docs/sd/5054050270_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py LGA, 14.
- Connector, B07B-XASK-1 (http://www.jst-mfg.com/product/pdf/eng/eXA1.pdf), generated with.
- Size 71.1x11.2mm^2 drill 1.3mm pad 2.6mm terminal.
- 0.995114 -0.0119414 facet normal 9.961873e-001 4.435372e-003.
- CR2016 DL2016 BR2020 CL2020 BR2025.