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Pin pitch=28.5mm, , length*diameter=20.32*12.07mm^2, Vishay, IHA-101, http://www.vishay.com/docs/34014/iha.pdf Inductor Axial series Axial Horizontal pin pitch 7.50mm length 9mm width 4.0mm Capacitor C, Rect series, Radial, pin pitch=10.00mm, , length*width=11.5*9.8mm^2, Capacitor, https://en.tdk.eu/inf/20/20/db/fc_2009/MKT_B32560_564.pdf C Rect series Radial pin pitch 15.24mm length 9.53mm diameter 5.21mm Diode, DO-201 series, Axial, Vertical, pin pitch=5.08mm, , length*diameter=16*7.5mm^2, Fastron, XHBCC, http://www.fastrongroup.com/image-show/26/XHBCC.pdf?type=Complete-DataSheet&productType=series Inductor Axial series Axial Horizontal pin pitch 10.16mm 0.25W = 1/4W length 6.3mm diameter 2.5mm SMD pad as test Point, diameter 4.0mm, 2 pins, pitch 3.5mm, size 49x7.6mm^2, drill diamater 1.2mm, pad diameter 3mm, see , script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_WAGO THT Terminal Block WAGO 236-401 45Degree pitch 7.5mm size 90x10.3mm^2 drill 1.3mm pad 2.6mm Terminal Block WAGO 236-105 45Degree pitch 5mm size 56.5x15mm^2 drill 1.2mm pad 2.4mm Terminal Block WAGO 804-102, 45Degree (cable under 45degree), 1 pins, pitch 5.08mm, size 66x9.8mm^2, drill diamater 1.1mm, pad diameter 3mm, see , script-generated with , script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_RND THT terminal block Metz Connect Type067_RT01904HDWC, 4 pins, pitch 5.08mm, size 20.3x8mm^2, drill diamater 1.15mm, pad diameter 3mm, see , script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_Phoenix THT Terminal Block 4Ucon ItemNo. 10694, vertical (cable from top), 8 pins, pitch 5mm, size 56.5x15mm^2, drill diamater 1.2mm, pad diameter 2.6mm, see http://www.farnell.com/datasheets/100425.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_MetzConnect THT terminal block Metz Connect Type067_RT01903HDWC, 3 pins, pitch 10mm, size 162x14mm^2, drill diamater 1.3mm, pad diameter 2.4mm, outer diameter 2.3mm, size source Multi-Contact FLEXI-E 1.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_noLead_generator.py Nexperia wafer level chip-size package; 15 bumps (6-3-6), 2.37x1.17mm, 15 Ball, 6x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb15cc.pdf#page=119 ST WLCSP-52, ST die ID 464, 2.58x3.07mm, 36 Ball, 6x6 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100302.PDF, https://pdfserv.maximintegrated.com/package_dwgs/21-100302.PDF NXP VFBGA-42, 3.0x2.6mm, 42 Ball, 6x7.

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