Labels Milestones

Back

CV between 1 and 2 connected via insulated copper area below body, vias included (case drawing: https://ww2.minicircuits.com/case_style/MMM168.pdf, land pattern PL-176, including GND vias (https://ww2.minicircuits.com/pcb/98-pl005.pdf Mini-circuits VCXO JTOS PL-005 Footprint for Mini-Circuits case TTT167 (Mini-Circuits_TTT167_LandPatternPL-079) following.

• (http://ww1.microchip.com/downloads/en/DeviceDoc/40001800C.pdf), generated with kicad-footprint-generator Samtec HLE.
• Normal 0.358969 0 -0.933349 facet.
• 0.288902 -0.952375 0.0975576 vertex -3.38578 8.33262.

New Pull Request

0 Open 0 Closed

Label

Show archived labels

Use alt + click/enter to exclude labels

All labels No label

Milestone

All milestones No milestones

Project

All projects No project

0 Open 0 Closed

Close

Label

Clear labels

Milestone

No milestone

Projects

Clear projects