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BackHeat conduction during soldering - ground plane Updates from real TL0x4s 82024e96c9 updated C14 footprint, traces, groundplane Find and replace last few thin traces, fix teardrops and gnd fill Embiggen traces, add teardrops updated C5 footprint & tracing; schematic annotation Add 55k-ish resistor to coarse knob to fix this and turn it into a corner for narrower modules if we want C3 and C4 could use fewer caps that way main MK_SEQ/Panels/10_step_seq.scad 387 lines // CV out - Gate out (could normal to TP10, optional) - Casc out 2x Toggle Switches, 2pin: - Glide attenuator (B10k) (join two left pins from below Pots, 2-pin: - Glide, manual (A100k) (two left pins, from below) - Clock Out - Diode from rotary pin 13? CV Out - 1K to U2-14 Case Out - 1K to U2-14 - Casc out 2x Toggle Switches, 2pin: - all step switches (all go to same bus 2x Pushbutton switches, all 2pin: - step - reset Pots, 3-pin: - Glide attenuator (B10k) (join two left pins from below Clock rate.
- (end 157.807501 128.725 (end 171.055.
- 1757491 12A || order number: 1803523 8A 160V.
- Double row surface-mounted straight.
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