Labels Milestones
BackPad, 4x4mm body, pitch 0.5mm UFBGA-64, 8x8 raster, 5x5mm package, pitch 0.8mm Altera BGA-68 M68 MBGA Altera VBGA V81 BGA-81 Altera BGA-100 M100 MBGA 121-ball, 0.8mm BGA (based on standard DIP-4), row spacing 7.62 mm (300 mils THT DIP DIL PDIP 2.54mm 25.4mm 1000mil Socket LongPads 4-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), SMDSocket, LongPads 5-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket 42-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), body size 9.78x19.96mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/204.pdf), SMD SMD DIP Switch SPST Slide 8.9mm 350mil SMD 2x-dip-switch SPST , Slide, row spacing 11.48 mm (451 mils 14-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), body size 10.8x16.8mm 6x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), Socket, LongPads 18-lead though-hole mounted.
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