Labels Milestones
Back2.17x2.225mm, 16 Ball, 4x4 Layout, 0.35mm Pitch, https://www.ti.com/lit/ml/mxbg383/mxbg383.pdf, https://www.ti.com/lit/ds/symlink/tps62800.pdf Texas Instruments, DSBGA, 0.9x1.9mm, 8 bump 3x3 (perimeter) array, NSMD pad definition Appendix A BGA 256 1 FT256 FTG256 Spartan-7 BGA, 18x18 grid, 15x15mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=303, NSMD pad definition (http://www.ti.com/lit/ds/slas718g/slas718g.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, area grid, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0102.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, VQFN-HR RNN0018A (http://www.ti.com/lit/ds/symlink/tps568215.pdf QFN, 16.
- SO, Exposed Die Pad (TI DDA0008B, see http://www.ti.com/lit/ds/symlink/lm3404.pdf.
- ....2mm_P5.00mm_FKS2_FKP2_MKS2_MKP2.kicad_mod | 35 ....2mm_P5.00mm_FKS2_FKP2_MKS2_MKP2.kicad_mod | 35 ..._Dual_Slotted_Mounting_Hole_NPTH.kicad_mod.