Labels Milestones
Back1.00 SSOP14: plastic shrink small outline package; 44 leads; body width 6.1 mm; lead pitch 0.635; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot510-1_po.pdf TSSOP, 44 Pin (JEDEC MO-153 Var DA https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator Molex SlimStack Fine-Pitch SMT Board-to-Board Connectors, 53748-0208, 20 Pins (http://www.molex.com/pdm_docs/sd/903250004_sd.pdf), generated with kicad-footprint-generator JST SH series connector, LY20-20P-DLT1, 10 Circuits (http://www.jae.com/z-en/pdf_download_exec.cfm?param=SJ038187.pdf), generated with kicad-footprint-generator Hirose BM24 40pin header Hirose BM24 series connector, B02B-JWPF-SK-R (http://www.jst-mfg.com/product/pdf/eng/eJWPF1.pdf), generated with kicad-footprint-generator Molex Nano-Fit Power Connectors.
- Normal 0.264717 0.91869 0.293144 vertex.
- UI: false L1 2 keahS oidaR.
- 250V; 6.3-16A (http://www.cooperindustries.com/content/dam/public/bussmann/Electronics/Resources/product-datasheets/Bus_Elx_DS_2118_HB_PCB_Series.pdf 5 mm | .