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1 FF1156 FFG1156 FFV1156 Virtex-7 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=304, NSMD pad definition Appendix A BGA 238 0.5 CP236 CPG236 Artix-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=276, NSMD pad definition (http://www.ti.com/lit/ds/symlink/bq51050b.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, double rows Through hole angled socket strip THT 1x03 1.27mm single row (from Kicad 4.0.7), script generated Through hole angled socket strip, 2x35, 1.27mm pitch, double rows Through hole straight pin header, 1x31, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Surface mounted socket strip THT 2x40 1.27mm double row surface-mounted straight pin header, 1x33, 1.00mm pitch, single row style2 pin1 right Through hole angled socket strip, 1x21, 2.00mm pitch, double rows Through hole angled pin header, 2x04, 2.00mm pitch, 6.35mm socket length, single row (https://gct.co/files/drawings/bc065.pdf), script generated Through hole straight pin header, 2x24.

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