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LEM Hall Effect Voltage transducer 3M 40-pin zero insertion force socket, through-hole, row spacing 7.62 mm (300 mils), see https://ac-dc.power.com/sites/default/files/product-docs/tinyswitch-iii_family_datasheet.pdf Power Integrations E Package eSIP-7F Flat Package with Heatsink Tab, https://ac-dc.power.com/sites/default/files/product-docs/topswitch-jx_family_datasheet.pdf Power Integrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body size 9.78x32.66mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile SMD 7x-dip-switch SPST Omron_A6S-710x, Slide, row spacing 9.53 mm (375 mils), Clearance8mm 22-lead surface-mounted (SMD) DIP package, row spacing 11.48 mm (451 mils 12-lead surface-mounted (SMD) DIP package, row spacing 9.53 mm (375 mils 14-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket.

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