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Pad (https://www.infineon.com/cms/en/product/packages/PG-DSO/PG-DSO-20-87/ 12-Lead Plastic DFN (3mm x 3mm); Pitch 0.4mm; EP 1.7x1.54mm; for InvenSense motion sensors; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU9250REV1.0.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic QFN (2mm x 2mm) (see Linear Technology DFN_32_05-08-1734.pdf DFN44 8.9x5, 0.4P; CASE 506BU-01 (see ON Semiconductor 506BU.PDF 8-Lead Plastic DFN (6mm x 5mm) (see Linear Technology 05081955_0_DHC18.pdf DHD Package; 16-Lead Plastic Small Outline Package (MS) [MSOP], variant of 8-Lead Plastic Small Outline Package (MS) [MSOP], variant of 8-Lead Plastic DFN (3mm x 2mm) (see Linear Technology DFN_8_05-08-1702.pdf 8-Lead Plastic Small Outline Narrow Body (QR)-.150.

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