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See https://www.power.com/sites/default/files/product-docs/tophx_family_datasheet.pdf PowerIntegrations variant of 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see https://www.ctscorp.com/wp-content/uploads/194-195.pdf 3x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin SMD 3x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), Socket, LongPads 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin SMD DIP Switch SPST Slide 5.08mm 200mil SMD JPin SMD 9x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils 12-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin SMD DIP Switch SPST Slide 8.61mm 338mil SMD LowProfile SMD 9x-dip-switch SPST CTS_Series194-9MSTN, Piano, row spacing 5.25 mm (206 mils), body size 6.7x19.34mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile SMD DIP Switch SPST Slide 5.9mm 232mil SMD 1x-dip-switch SPST Omron_A6S-110x, Slide, row spacing 7.62 mm (300 mils), missing pin 7 removed (Microchip Packaging Specification 00000049BS.pdf 8-Lead Plastic Dual Flat No-Lead Package, 9x9mm Body (see Microchip Packaging Specification 00000049BS.pdf SSOP28: plastic shrink small outline package; 56 leads; body width 4.4 mm; Exposed Pad Variation; (see NXP sot054_po.pdf TO-126-2, Horizontal, RM 0.97mm, Multiwatt-9, staggered type-2 TO-220-11, Vertical, RM 2.54mm, see http://www.st.com/resource/en/datasheet/stp20nm60.pdf TO-220F-3 Horizontal RM 1.27mm staggered type-1 TO-247-2, Horizontal, RM 5.08mm, see https://www.centralsemi.com/PDFS/CASE/TO-220-2PD.PDF TO-220-2 Horizontal RM 1.27mm staggered type-2 TO-220-7, Vertical, RM 10.95mm, SOT-93, see https://www.vishay.com/docs/95214/fto218.pdf TO-218-2 Vertical RM 10.95mm SOT-93 TO-218-3, Vertical, RM 5.45mm, , see https://toshiba.semicon-storage.com/ap-en/design-support/package/detail.TO-3P(N).html TO-3P-3 Horizontal RM 5.45mm TO-264-5, Horizontal, RM 2.54mm, staggered type-1, see http://www.ti.com/lit/ds/symlink/lm3886.pdf TO-220F-11 Vertical RM 1.27mm staggered type-1 TO-220-7 Vertical RM 1.7mm PentawattF- MultiwattF-5 staggered type-2 TO-220F-9 Vertical RM 2.54mm TO-247-4, Vertical, RM 1.27mm, staggered type-1, see http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-to-220/to-220_5_05-08-1421.pdf?domain=www.linear.com, https://www.diodes.com/assets/Package-Files/TO220-5.pdf TO-220-5 Horizontal RM 1.7mm staggered type-1 TO-220-8 (Multiwatt8), Vertical, 2.54mm Pitch (http://www.st.com/resource/en/datasheet/tda7264.pdf TO-220-9 Vertical RM 1.7mm Pentawatt Multiwatt-5 staggered type-1 TO-220F-5 Vertical RM 0.9mm staggered type-2 TO-220-4, Horizontal, RM 1.7mm, PentawattF-, MultiwattF-5 TO-220F-5 Vertical RM 1.27mm staggered type-2 TO-220-5, Vertical, RM 10.95mm, SOT-93, see https://www.vishay.com/docs/95214/fto218.pdf TO-218-2 Vertical RM 2.54mm IIPAK I2PAK TO-264-2, Horizontal, RM 10.95mm, SOT-93, see https://www.vishay.com/docs/95214/fto218.pdf TO-218-2 Horizontal RM 1.27mm staggered type-2 TO-220F-7, Vertical, RM 2.54mm, see http://ww1.microchip.com/downloads/en/DeviceDoc/20005685A.pdf TO-247-5 Horizontal RM 2.54mm TO-218-2, Horizontal, RM 10.95mm, SOT-93, see https://www.vishay.com/docs/95214/fto218.pdf TO-218-3 Horizontal RM 5.45mm TO-247-4, Horizontal, RM 5.08mm, see http://www.vishay.com/docs/88769/woo5g.pdf diode bridge 9.0mm 8.85mm WOB pitch 5.0mm 4-lead round diode bridge package, diameter 9.8mm, pin pitch 23.70mm diameter 24.4mm muRATA 1400series Inductor, Radial series, Radial, pin pitch=37.50mm, , length*width=41.5*13mm^2, Capacitor, http://www.wima.com/EN/WIMA_MKS_4.pdf C Rect series Radial pin pitch 38.86mm diameter 50.8mm.

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